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(DEFECT) METAL BUILD Freedom Gundam 2.0 CONCEPT (Mobile Suit Gundam SEED)
From Bandai
Code: BIB2021-04-12T130907.84079118

Condition: MIB
Defect(s): Small chip on left pauldron.
Content condition: Content in good condition.

Product is sold as-is and all sales will be final, purchase at your own risk. Further defects encountered may not be covered or refunded.

Product details, you can read it here

Assemble Guide: No assembly required.

Our Price: MYR1388.00

  Discontinued  

FREE SHIPMENT
Only applicable within Peninsula Malaysia.
NOT applicable for Sabah, Sarawak & international order.



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